Premjeet Chahal
American electrical engineer
From Wikipedia, the free encyclopedia
Premjeet "Prem" Chahal is an Indian-American electrical engineer and professor in the Department of Electrical and Computer Engineering at Michigan State University. He is known for his research in terahertz and millimeter-wave electronics, additive manufacturing, and electronics packaging. He was elected a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2024 "for contributions to additive manufacturing and materials characterization."[1]
Georgia Institute of Technology (Ph.D.)
Additive manufacturing
Electronics packaging
Premjeet Chahal | |
|---|---|
| Born | India |
| Alma mater | Iowa State University (B.S., M.S.) Georgia Institute of Technology (Ph.D.) |
| Known for | Terahertz electronics Additive manufacturing Electronics packaging |
| Awards | DARPA Young Faculty Award (2012) IEEE Fellow (2024) |
| Scientific career | |
| Fields | Electrical engineering Microwave engineering |
| Institutions | Raytheon (1999–2006) Abbott Laboratories (2006–2008) Michigan State University National Science Foundation (rotator) |
| Thesis | Integral resistors and capacitors for mixed-signal packages using electroless plating and polymer-ceramic nanocomposites (1999) |
| Doctoral advisor | Mark G. Allen |
Education
Chahal received his Bachelor of Science and Master of Science degrees in electrical engineering from Iowa State University.[2] He earned his Ph.D. in electrical engineering from the Georgia Institute of Technology in 1999.[2]
Career
After completing his doctorate, Chahal worked as a senior researcher at Raytheon in Dallas, Texas from 1999 to 2006, where he conducted research in terahertz technologies, MMIC design, RF-MEMS, and sensors.[3] He then held a senior research position at Abbott Laboratories from 2006 to 2008, leading research in BioMEMS.[3]
Chahal joined Michigan State University as a faculty member in 2009.[2] He is a member of the Electromagnetics Research Group (EMRG)[4] and is affiliated with the Axia Institute.[3] Since 2021, he has served as a program director (rotator) at the National Science Foundation in the Engineering Directorate's Electrical, Communications and Cyber Systems (ECCS) division.[2]
Research
Chahal's research interests include terahertz and millimeter-wave electronics, infrared sensors, microsystems packaging, RF-MEMS, BioMEMS, flexible electronics, and additive manufacturing.[4] His work on heterogeneous integration uses additive manufacturing (3D printing) to integrate different device technologies within single units, enabling applications in advanced packaging for computing, quantum systems, and communications.[2]
He has published over 250 refereed journal and conference papers and holds 13 U.S. patents.[2] According to Google Scholar, his work has been cited over 3,900 times.[5]
Awards and honors
- DARPA Young Faculty Award, 2012[2]
- MSU Withrow Teaching Excellence Award, 2016[2]
- Fellow, Institute of Electrical and Electronics Engineers (IEEE), 2024[1]