User:Henriok

Initiated by me, from scratch

Major contributions by me

Prototypes / Work in progress

Created or uploaded by me

• 
  PowerPC 601
• 
  PowerPC 601v
• 
  PowerPC 603 in a ceramic BGA package
• 
  PowerPC 603 in a wire bond QFP
• 
  PowerPC 604e
• 
  PowerPC 750 from a PowerMac
• 
  PowerPC 750CXe in a HPBGA package
• 
  PowerPC Gekko from a Nintendo GameCube
• 
  PowerPC 7450
• 
  PowerPC 7455
• 
  POWER3s in an RS/6000
• 
  A PowerPC 855T PowerQUICC processor in a plastic BGA package
• 
  MPC8245 in a Qlogic SANbox 5200 in TBGA package
• 
  MPC5200
• 
  CPU board of an ANS700
• 
  ExpressCards vs PCCard
• 
  Bedstraw Hawk moth larva (Hyles gallii), Uppsala, Sweden
• 
  Screenshot of Yellow Dog Linux, v5.0
• 
  IBM STB04500. In a "Dilog DT 550", a PowerPC based set top box.
• 
  A schematic showing the evolution of the different POWER, PowerPC and Power ISAs.
• 
  A scematic of the TriBlade module in the Roadrunner supercomputer
• 
  A schematic overview of Roadrunner
• 
  A schematic overview of Blue Gene/L
• 
  A schematic overview of Blue Gene/P
• 
  The chip complex of the RIOS-1 processor
• 
  The chip complex of the RIOS.9 processor
• 
  The MCM of a POWER2 processor
• 
  A generic Power Architecture processor
• 
  Great Black-backed Gull photographed by Fredrik Dolk in Stockholm.
• 
  Charles Edge
• 
  Timo Sirainen
• 
  A schematic overview of the SpursEngine chip
• 
  A schematic overview of the QCDOC chip
• 
  A schematic overview of the RISC Single Chip chip
• 
  A schematic overview of the POWER3 chip
• 
  A schematic overview of the POWER4 chip
• 
  A schematic overview of one POWER4 core
• 
  An illustrated Apple A4 processor
• 
  An illustrated Apple A5 processor
• 
  AMCC PowerPC 440SPe processor
• 
  An illustrated Apple A5X processor
• 
  An illustrated Apple A5 R2 processor
• 
  An illustrated Apple A6 processor
• 
  An illustrated Apple A6X processor
• 
  An illustration of the Nintendo Wii U processor, with heat spreader
• 
  An illustration of the Nintendo Wii U processor MCM, without the heat spreader
• 
  An illustration of the application processor SoC in Apple's iPod nano 4 and iPod touch 2
• 
  An illustration of the application processor SoC in Apple's original iPhone, iPhone 3G and original iPod touch
• 
  An illustration of the application processor SoC in Apple's iPhone 3GS
• 
  An illustration of the application processor SoC in Apple's iPod touch 3
• 
  An illustration of the XCPU-ES in Microsoft's Xbox 360
• 
  An illustration of the XCPU "Zephyr" in Microsoft's Xbox 360
• 
  An illustration of the XCPU "Falcon" in Microsoft's Xbox 360
• 
  An illustration of the XCGPU in Microsoft's Xbox 360S
• 
  An illustration of the XCGPU in Microsoft's Xbox 360S with heatspreader
• 
  An illustration of Toshiba's SpursEngine accelerator chip
• 
  An illustration of IBM's PowerPC 970 processor
• 
  An illustration of IBM's PowerPC970FX processor
• 
  An illustration of IBM's PowerPC 970MP dual core processor
• 
  An illustration of IBM's defunct PowerPC 970GX processor
• 
  An illustrated Apple A5 R3 processor
• 
  An illustration of Motorola's PowerPC 750 processor
• 
  An illustration of Motorola's PowerPC 740 processor
• 
  An illustration of Motorola's PowerPC 755 processor
• 
  An illustration of IBM's PowerPC 750L processor
• 
  An illustration of IBM's PowerPC 740L processor
• 
  An illustration of IBM's PowerPC 750CX processor
• 
  An illustration of IBM's PowerPC 750CXe processor
• 
  An illustration of IBM's Gekko processor
• 
  An illustration of IBM's PowerPC 750FX processor
• 
  An illustration of IBM's PowerPC 750GX processor
• 
  An illustration of IBM's PowerPC 750CL processor
• 
  An illustration of IBM's Broadway A processor
• 
  An illustrated Apple A7 processor
• 
  An illustrated Apple M7 co-processor
• 
  The size difference between the M7 and A7 according to Apple
• 
  The LPC18A1, aka "Apple M7"
• 
  The size difference between the LPC18A1 and A7
• 
  The RAD750 radiation hardened processor
• 
  An illustration of IBM's POWER3 processor
• 
  An illustration of IBM's POWER3-II processor
• 
  An illustration of IBM's POWER4 processor on a single chip module
• 
  An illustration of IBM's POWER4 processor on a dual chip module
• 
  An illustration of IBM's POWER4 processor on a multi chip module
• 
  An illustration of IBM's POWER5 processor on a dual chip module
• 
  An illustration of IBM's POWER5 processor on a multi chip module
• 
  An illustration of IBM's POWER5+ processor on a dual chip module
• 
  An illustration of IBM's POWER5+ processor on a quad chip module
• 
  An illustration of IBM's POWER6 processor on a ceramic substrate
• 
  An illustration of IBM's POWER6 processor on an organic substrate
• 
  An illustration of IBM's POWER6 processor on a dual chip module
• 
  An illustration of IBM's POWER6 processor on a multi chip module
• 
  An illustration of IBM's POWER7 processor on a ceramic substrate
• 
  An illustration of IBM's POWER7 processor on an organic substrate
• 
  An illustration of IBM's POWER7 processor on a multi chip module
• 
  An illustration of BAE's RAD6000 radiation hardened space processor
• 
  The 90 nm CellBroadband Engine, the CPU of the PlayStation 3.
• 
  The Cell/B.E. with its lid on.
• 
  The underside of the 90 nm Cell/B.E.
• 
  The 65 nm version of Cell/B.E.
• 
  The 45 nm version of Cell/B.E.
• 
  The 65 nm high performance PowerXCell 8i.
• 
  An illustration of IBM's P2SC+ processor.
• 
  An illustration of IBM's POWER1 RSC processor.
• 
  An illustration of IBM's POWER2 processor.
• 
  An illustration of IBM's POWER2+ processor.
• 
  An illustration of IBM's POWER8 DCM processor.
• 
  An illustration of the Apple A8 system-on-a-chip.
• 
  An illustration of the Apple S1 integrated computer (defunct)
• 
  An illustration of the Apple S1 integrated computer
• 
  An illustration of the Apple S1 integrated computer, chips showing.
• 
  This is how large the S1 is compared to the Apple Watch.
• 
  The LPC18B1, aka "Apple M8"
• 
  The size difference between the LPC18B1 and A8
• 
  An illustration of the Apple A8X system-on-a-chip.
• 
  An illustration of Motorola's MPC7400 processor.
• 
  An illustration of Motorola's MPC7410 processor.
• 
  An illustration of Freescale's MPC7410 processor.
• 
  An illustration of Motorola's MPC7450 processor.
• 
  An illustration of Motorola's MPC7440 processor.
• 
  An illustration of Motorola's MPC7455 processor.
• 
  An illustration of Motorola's MPC7445 processor.
• 
  An illustration of Motorola's MPC7457 processor.
• 
  An illustration of Freescale's MPC7447/A processor.
• 
  An illustration of Freescale's MPC7448 processor.
• 
  An illustration of Freescale's MPC8641D processor.
• 
  An illustration of Freescale's MPC8610 processor.
• 
  An illustration of Freescale's MPC8640D processor.
• 
  An illustration of the MPC7400 manufactured by IBM on Apple's request.
• 
  An illustration of IBM's Broadway-1 processor.
• 
  An illustration of IBM's Broadway-1 processor, without heat spreader.
• 
  An illustration of IBM's Broadway B processor.
• 
  An illustration of IBM's Broadway B processor, without heat spreader.
• 
  An illustration of IBM's Broadway processor.
• 
  An illustration of IBM's Broadway processor, without heatspreader.
• 
  An illustration of Samsung's Apple A9 system-on-a-chip.
• 
  An illustration of TSMC's Apple A9 system-on-a-chip.
• 
  An illustration of TSMC's Apple A9X system-on-a-chip.
• 
  An illustration of TSMC's Apple A10 Fusion system-on-a-chip.
• 
  An illustration of the Apple S2 integrated computer.
• 
  An illustration of the Apple S1P integrated computer.
• 
  This is how large the S2 is compared to the Apple Watch.

And these (logos must not be shown in user pages)