Beth Keser
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Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society.
Keser is originally from Rochester, New York; where many of her childhood friends were children of engineers.[1][2] She focused on materials science[2] as an undergraduate at Cornell University, graduating in 1993,[3] and earned a Ph.D. in 1997 from the University of Illinois Urbana-Champaign.[3]
After postdoctoral work in a research and development laboratory,[1] she worked on advanced electronic packaging at Motorola for twelve years.[4] In 2009,[3] she became the leader of the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for Qualcomm,[4] before moving to her present position at Intel. Dr. Keser left Intel in 2023 and is currently the VP of Manufacturing at Zero ASIC. [1]
She was elected as president of the International Microelectronics and Packaging Society for the 2021–2023 term.[5]