Diazonaphthoquinone

Diazonaphthoquinone (DNQ) is a diazo derivative of naphthoquinone. Upon exposure to light, DNQ converts to a derivative that is susceptible to etching. In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry.^[1]

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Diazonaphthoquinone

Names
Preferred IUPAC name 2-Diazonaphthalen-1(2H)-one
Other names 1,2-Naphthoquinone diazide
Identifiers
CAS Number	879-15-2 Y
3D model (JSmol)	Interactive image
ChemSpider	7991089 N
PubChem CID	9815339
CompTox Dashboard (EPA)	DTXSID501028139
InChI InChI=1S/C10H6N2O/c11-12-9-6-5-7-3-1-2-4-8(7)10(9)13/h1-6H N Key: URQUNWYOBNUYJQ-UHFFFAOYSA-N N InChI=1/C10H6N2O/c11-12-9-6-5-7-3-1-2-4-8(7)10(9)13/h1-6H Key: URQUNWYOBNUYJQ-UHFFFAOYAU
SMILES O=C(C(C=C2)=[N]=[N])C1=C2C=CC=C1
Properties
Chemical formula	C10H6N2O
Molar mass	170.171 g·mol−1
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa). N verify (what is YN ?) Infobox references

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Diazonaphthoquinone sulfonic acid esters are components of common photoresist materials. Such photoresists are used in the manufacture of semiconductors.^[2][3][4] In this application DNQs are mixed with Novolac resin, a type of phenolic polymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed. In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains insoluble in the aqueous base developer. In the exposed regions, the DNQ forms a ketene, which, in turn, reacts with ambient water to form a base-soluble indene carboxylic acid. The exposed regions of the photoresist film become soluble in aqueous base; thus allowing the formation of a relief image during development.