Fluorosilicate glass
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Fluorosilicate glass (FSG) is a glass material composed primarily of fluorine, silicon and oxygen. It has a number of uses in industry and manufacturing, especially in semiconductor fabrication where it forms an insulating dielectric. The related fluorosilicate glass-ceramics have good mechanical and chemical properties.
FSG has a small relative dielectric constant (low-κ dielectric) and is used in between metal copper interconnect layers during silicon integrated circuit fabrication process. It is widely used by semiconductor fabrication plants on geometries under 0.25 microns (μ). FSG is effectively a fluorine-containing silicon dioxide (κ=3.5, while κ of undoped silicon dioxide is 3.9).[1] FSG is used by IBM.[2] Intel started using Cu metal layers and FSG on its 1.2 GHz Pentium processor at 130 nm complementary metal–oxide–semiconductor (CMOS). Taiwan Semiconductor Manufacturing Company (TSMC) combined FSG and copper in the Altera APEX.
