LGA 1200
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 | |
| Release date | May 27, 2020 |
|---|---|
| Designed by | Intel |
| Manufactured by | Foxconn |
| Type | LGA-ZIF |
| Chip form factors | Flip-chip |
| Contacts | 1200 |
| FSB protocol | PCI Express |
| Processors | |
| Predecessor | LGA 1151 |
| Successor | LGA 1700 |
| Memory support | DDR4 |
This article is part of the CPU socket series | |
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.[1][2]
LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips.[3]
ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs.[4][5][6][7] Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs.[8][9]
Comet Lake chipsets (400 series)
Memory support configuration common for all chipsets:
- Dual channel DDR4-2666 or DDR4-2933
| H410 | B460 | H470 | Q470 | Z490 | W480 | ||
|---|---|---|---|---|---|---|---|
| Overclocking | Thermal limits CPU overclocking is offered by ASRock, ASUS and MSI[13][14] | No | Yes | No | |||
| Bus Interface | DMI 3.0 x4 | ||||||
| CPU support | Comet Lake-S only[15][16] | Comet Lake-S / Rocket Lake (a BIOS update is required)[16][17] | |||||
| Memory support | Up to 64 GB | Up to 128 GB | |||||
| Maximum DIMM slots | 2 | 4 | |||||
| ECC memory | No | UDIMM | |||||
| Maximum USB 2.0 ports | 10 | 12 | 14 | ||||
| USB 3.2 ports configuration | Gen 1x1 | Up to 4 | Up to 8 | Up to 10 | |||
| Gen 2x1 | N/A | Up to 4 | Up to 6 | Up to 8 | |||
| Maximum SATA 3.0 ports | 4 | 6 | 8 | ||||
| Processor PCI Express v3.0 configuration | 1x16 | 1x16 or 2x8 or 1x8+2x4 | |||||
| PCH PCI Express configuration | 6 | 16 | 20 | 24 | |||
| Independent Display Support (digital ports/pipes) | 2 | 3 | |||||
| Integrated Wireless (802.11ax) | No | Intel Wi-Fi 6 AX201[a] | |||||
| SATA RAID 0/1/5/10 support | No | Yes | |||||
| Intel Optane Memory Support | |||||||
| Intel Smart Sound Technology | |||||||
| Intel Active Management, Trusted Execution and vPro Technology | No | Yes | No | Yes | |||
| Chipset TDP | 6W | ||||||
| Chipset lithography | 22 nm[18] | 14 nm[18] | |||||
| Release date | Q2 2020 | ||||||