List of AMD Ryzen processors

From Wikipedia, the free encyclopedia

The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

Desktop processors

Ryzen 1000 series

Summit Ridge (1000 series, Zen based)

Common features of Ryzen 1000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2666 in dual-channel mode.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14 LP.
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Core
config[i]		 Thermal Solution Release
date		 Launch
price[a]
Base PBO
1–2
(≥3)		 XFR[1]
1–2
Ryzen 7 1800X[2] 8 (16) 3.6 4.0
(3.7)		 4.1 16 MB 95 W 2 × 4 Wraith Max March 2, 2017 US $499
1700X PRO 3.4 3.8
(3.5)		 3.9 N/a June 29, 2017 OEM
1700X[2] Wraith Max March 2, 2017 US $399
1700 PRO 3.0 3.7
(3.2)		 3.75 65 W N/a June 29, 2017 OEM
1700[2] Wraith Spire March 2, 2017 US $329
Ryzen 5 1600X[3] 6 (12) 3.6 4.0
(3.7)		 4.1 95 W 2 × 3 Wraith Max April 11, 2017 US $249
1600 PRO 3.2 3.6
(3.4)		 3.7 65 W N/a June 29, 2017 OEM
1600[3] Wraith Stealth April 11, 2017 US $219
1500X[3] 4 (8) 3.5 3.7
(3.6)		 3.9 2 × 2 Wraith Spire (No LED) US $189
1500 PRO N/a June 29, 2017 OEM
1400[3] 3.2 3.4
(3.4)		 3.45 8 MB Wraith Stealth April 11, 2017 US $169
Ryzen 3 1300X[4] 4 (4) 3.5 3.7
(3.5)		 3.9 July 27, 2017 US $129
1300 PRO N/a June 29, 2017 OEM
1200 PRO 3.1 3.4
(3.1)		 3.45
1200[4] Wraith Stealth July 27, 2017 US $109
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

Whitehaven (Threadripper 1000 series, Zen based)

Common features of Ryzen 1000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2666 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14LP.
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 Launch
price[a]
Base PBO
1–4
(≥5)		 XFR[1]
1–2
Ryzen
Threadripper		 1950X[5] 16 (32) 3.4 4.0
(3.7)		 4.2 32 MB 180 W 2 × CCD[ii] 4 × 4 August 10, 2017 US $999
1920X[5] 12 (24) 3.5 4 × 3 US $799
1900X[5] 8 (16) 3.8 4.0
(3.9)		 16 MB 2 × 4 August 31, 2017 US $549
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

Ryzen 2000 series

Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Common features of Ryzen 2000 desktop APUs:

More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date		 Launch
price[a]
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Model Clock
(GHz)		 Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 2400G[6][b] 4 (8) 3.6 3.9 4 MB RX Vega 11 1.25 704:44:16
11 CU		 1760 46–65 W February 12, 2018 US $169
2400GE[b] 3.2 3.8 35 W April 19, 2018 OEM
Ryzen 3 2200G[6][b] 4 (4) 3.5 3.7 Vega 8 1.1 512:32:16
8 CU		 1126 46–65 W February 12, 2018 US $99
2200GE[b] 3.2 3.6 35 W April 19, 2018 OEM
PRO 2100GE[7] 2 (4) N/a Vega 3 1.0 192:12:4
3 CU[8]		 384 2019
Close
  1. [i]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. [ii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    Manufacturer suggested retail price at launch
  2. [b]
    Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.[9]

Pinnacle Ridge (2000 series, Zen+ based)

Common features of Ryzen 2000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Core
config[i]		 Thermal Solution Release
date		 Launch
price[a]
Base PB2
Ryzen 7 2700X[10][b] 8 (16) 3.7 4.3 16 MB 105 W 2 × 4 Wraith Prism April 19, 2018 US $329
2700[10][b] 3.2 4.1 65 W Wraith Spire US $299
2700E 2.8 4.0 45 W N/a September 19, 2018 OEM
Ryzen 5 2600X[10] 6 (12) 3.6 4.2 95 W 2 × 3 Wraith Spire April 19, 2018 US $229
2600[10][b] 3.4 3.9 65 W Wraith Stealth US $199
2600E 3.1 4.0 45 W N/a September 19, 2018 OEM
1600 (AF)[14][c] 3.2 3.6 65 W Wraith Stealth October 11, 2019[15] US $85
2500X 4 (8) 3.6 4.0 8 MB 1 × 4 N/a September 10, 2018 OEM
Ryzen 3 2300X 4 (4) 3.5
1200 (AF)[16][c] 3.1 3.4 Wraith Stealth April 21, 2020 US $60
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  1. [a]
    Manufacturer suggested retail price at launch
  2. [b]
    Model also available as PRO version as 2600[11], 2700[12], 2700X[13], released on September 19, 2018.
  3. [c]
    AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200[17] and 1600[18] with "AF" instead of "AE" in the part numbers). AMD officially considers these CPUs as part of the 1000 Series.

Colfax (Threadripper 2000 series, Zen+ based)

Common features of Ryzen 2000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2933 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 Launch
price[a]
Base PB2
Ryzen
Threadripper		 2990WX[19] 32 (64) 3.0 4.2 64 MB 250 W 4 × CCD 8 × 4 Aug 13, 2018 US $1799
2970WX[19] 24 (48) 8 × 3 Oct 2018 US $1299
2950X[19] 16 (32) 3.5 4.4 32 MB 180 W 2 × CCD 4 × 4 Aug 31, 2018 US $899
2920X[19] 12 (24) 4.3 4 × 3 Oct 2018 US $649
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

Ryzen 3000 series

Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Common features of Ryzen 3000 desktop APUs:

More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date		 MSRP
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Model Clock
(GHz)		 Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 PRO 3400G 4 (8) 3.7 4.2 4 MB Radeon
RX Vega 11		 1.4 704:44:8
11 CU		 1971.2 65 W Sep 30, 2019 OEM
3400G[iii][21] Jul 7, 2019 US $149
PRO 3400GE 3.3 4.0 1.3 1830.4 35 W Sep 30, 2019 OEM
PRO 3350G 3.6 Radeon
Vega 10		 640:40:8
10 CU		 1664 65 W Jul 21, 2020
PRO 3350GE 4 (4) 3.3 3.9 1.2 1536 35 W
Ryzen 3 PRO 3200G 3.6 4.0 Radeon
Vega 8		 1.25 512:32:8
8 CU		 1280 65 W Sep 30, 2019
3200G[21] Jul 7, 2019 US $99
3200GE 3.3 3.8 1.2 1228.8 35 W Jul 7, 2019 OEM
PRO 3200GE Sep 30, 2019
Close
  1. [i]
    Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. [ii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. [iii]
    Prior to August 1, 2025, included a Wraith Spire cooler. Starting August 1, 2025, includes a Wraith Stealth instead.[20]

Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of which are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets[i] Core
config[ii]		 Thermal Solution Release
date		 MSRP
Base Boost
Ryzen 9 3950X 16 (32) 3.5 4.7 64 MB 105 W[iii] 2 × CCD
1 × I/OD		 4 × 4 N/a Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X 4.6 Wraith Prism Jul 7, 2019
3900[a] 3.1 4.3 65 W N/a Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) 3.9 4.7 32 MB 105 W 1 × CCD
1 × I/OD		 2 × 4 N/a Jul 7, 2020 US $399
3800X 4.5 Wraith Prism Jul 7, 2019
3700X[a] 3.6 4.4 65 W[iv] US $329
Ryzen 5 3600XT 6 (12) 3.8 4.5 95 W 2 × 3 N/a Jul 7, 2020 US $249
3600X 4.4 Wraith Spire (non-LED) Jul 7, 2019
3600[a] 3.6 4.2 65 W Wraith Stealth US $199
3500X[24] 6 (6) 4.1 Oct 8, 2019 CNY 1099
(Mainland China Only)
3500 16 MB N/a Nov 15, 2019 OEM (Worldwide)

JPY 16000
(Japan Only)[25]

Ryzen 3 3300X 4 (8) 3.8 4.3 1 × 4 Wraith Stealth Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
Close
  1. [i]
    A Core Complex Die contains 1-2 Core Complexes (CCXs).
  2. [ii]
    Core Complexes (CCXs) × cores per CCX
  3. [iii]
    Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[22]
  4. [iv]
    Ryzen 7 3700X may consume 90 W under load.[23]
  1. [a]
    Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
  • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 MSRP
Base Boost
Ryzen
Threadripper
PRO		 3995WX 64 (128) 2.7 4.2 256 MB 280 W
[ii]		 8 × CCD
1 × I/OD		 16 × 4 Jul 14, 2020
3975WX 32 (64) 3.5 128 MB 4 × CCD
1 × I/OD		 8 × 4
3955WX 16 (32) 3.9 4.3 64 MB 2 × CCD
1 × I/OD		 4 × 4
3945WX 12 (24) 4.0 4 × 3
Ryzen
Threadripper		 3990X 64 (128) 2.9 256 MB 8 × CCD
1 × I/OD		 16 × 4 Feb 7, 2020 US $3990
3970X 32 (64) 3.7 4.5 128 MB 4 × CCD
1 × I/OD		 8 × 4 Nov 25, 2019 US $1999
3960X 24 (48) 3.8 8 × 3 US $1399
Close
  1. [i]
    Core Complexes (CCXs) × cores per CCX
  2. [ii]
    Ryzen Threadripper 3990X may consume over 490 W under load.[26]

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
    • The AMD 4700S uses the BGA 2197 socket and the 4800S uses BGA 2963.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.[27][28][29]

More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Core
config[i]		 Release
date		 MSRP
Base Boost
AMD 4800S[27][28] 8 (16) 4.0 8 MB 2 × 4 2022 bundled with desktop kit
4700S[29] 3.6 75 W 2021
Ryzen 5 4500 6 (12) 4.1 65 W 2 × 3 Apr 4, 2022 US $129
Ryzen 3 4100 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5.1 based)

Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
More information Branding and model, CPU ...
Branding and model CPU GPU TDP Release
date		 Release
price
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
Config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b]		 2.1 512:32:16
8 CU		 2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][30] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU		 1702.4 65 W Jul 21, 2020
(OEM)
Apr 4, 2022
(retail)		 US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU		 1305.6 65 W
4300GE[a] 3.5 35 W
Close
  1. [i]
    Core complexes (CCXs) × cores per CCX
  2. [ii]
    Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. [iii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    Model also available as PRO version as 4350GE,[31] 4350G,[32] 4650GE,[33] 4650G,[34] 4750GE,[35] 4750G,[36] released on July 21, 2020 for OEM only. Refresh models 4355GE, 4355G, 4655GE, 4655G released November 11, 2022.[37]
  2. [b]
    All of the iGPUs are branded as AMD Radeon Graphics.

Ryzen 5000 series

Vermeer (5000 series, Zen 3 based)

Common features of Ryzen 5000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
  • L2 cache: 512 KB per core.
  • Fabrication process: TSMC 7FF.
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Thermal
solution		 Release
date		 MSRP
Base Boost
Ryzen 9 5950X 16 (32) 3.4 4.9 64 MB 105 W 2 × CCD
1 × I/OD		 2 × 8 N/a Nov 5, 2020 US $799
5900XT 3.3 4.8 Jul 31, 2024 US $349
5900X 12 (24) 3.7 2 × 6 Nov 5, 2020 US $549
5900 3.0 4.7 65 W Jan 12, 2021 OEM
PRO 5945 Sep 2022[38]
Ryzen 7 5800X3D 8 (16) 3.4 4.5 96 MB 105 W 1 × CCD
1 × I/OD		 1 × 8 Apr 20, 2022 US $449
5800XT 3.8 4.8 32 MB Wraith Prism, None[ii] Jul 31, 2024 US $249
5800X 4.7 N/a Nov 5, 2020 US $449
5800 3.4 4.6 65 W Jan 12, 2021 OEM
5700X3D 3.0 4.1 96 MB 105 W Jan 31, 2024[40] US $249
5700X 3.4 4.6 32 MB 65 W Apr 4, 2022 US $299
PRO 5845 Sep 2022 OEM
Ryzen 5 5600X3D 6 (12) 3.3 4.4 96 MB 105 W 1 × 6 Jul 7, 2023 US $229[41]
US Only[42]
5600XT 3.7 4.7 32 MB 65 W Wraith Stealth[43] Oct 31, 2024 US $194[44]
5600X 3.7 4.6 Nov 5, 2020 US $299
5600T 3.5 4.5 Oct 31, 2024 US $186[44]
5600 3.5 4.4 Apr 4, 2022 US $199
5600F 3.0 4.0 Sep 16, 2025 APJ Only[45]
PRO 5645 3.7 4.6 N/a Sep 2022 OEM
5500X3D 3.0 4.0 96 MB 105 W Jun 5, 2025 LATAM Only[46]
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    On August 1, 2025, AMD downgraded or ceased including coolers on select models, as a result of its discontinuation of the Wraith Prism and Wraith Spire.[39]

Cezanne (5000 series, Zen 3 based)

Cézanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:

  • Socket: AM4.
  • CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Thermal
solution		 Clock rate (GHz) L3 cache
(total)		 TDP Core
config[i]		 Release
date		 MSRP
(USD)
Base Boost
Ryzen 7 5700[47] 8 (16) Wraith Stealth 3.7 4.6 16 MB 65 W 1 × 8 Apr 4, 2022 (OEM),
Dec 21, 2023 (retail)		 $179
Ryzen 5 5500 6 (12) 3.6 4.2 1 × 6 Apr 4, 2022 $159
Ryzen 3 5100[48][49][50] 4 (8) – 3.8 8 MB 1 × 4 2023 OEM
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5.1 based)

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
More information Branding and model, CPU ...
Branding and model CPU GPU[a] Thermal
solution		 TDP Release
date		 MSRP
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Clock
(MHz)		 Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5705G 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU		 2048 N/a 65 W
5700G[b] Wraith Stealth Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)		 US $359
5705GE 3.2 N/a 35 W
5700GE[b] Wraith Stealth Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU		 1702.4 65 W Jan 31, 2024[51] US $140
5605G 3.9 4.4 N/a
5600G[b] Wraith Stealth Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)		 US $259
5605GE 3.4 N/a 35 W
5600GE[b] Wraith Stealth Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[51] US $125
Ryzen 3 5305G 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU		 1305.6 N/a
5300G[b] OEM Apr 13, 2021 OEM
5305GE 3.6 N/a 35 W
5300GE[b] OEM Apr 13, 2021 OEM
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : texture mapping units : render output units and compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    All of the iGPUs are branded as AMD Radeon Graphics.
  2. [b]
    Model also available as PRO version as 5350GE,[52] 5350G,[53] 5650GE,[54] 5650G,[55] 5750GE,[56] 5750G,[57] released June 1, 2021. Refresh models 5355GE, 5355G, 5655GE, 5655G, 5755GE, 5755G released September 5, 2024.[58]

Chagall (Threadripper 5000 series, Zen 3 based)

Common features of Ryzen 5000 workstation CPUs:

  • Socket: sWRX8.
  • All the CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 MSRP
Base Boost
Ryzen
Threadripper
PRO		 5995WX 64 (128) 2.7 4.5 256 MB 280 W 8 × CCD
1 × I/OD		 8 × 8 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $6500
5975WX 32 (64) 3.6 128 MB 4 × CCD
1 × I/OD		 4 × 8 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $3300
5965WX 24 (48) 3.8 4 × 6 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $2400
5955WX 16 (32) 4.0 64 MB 2 × CCD
1 × I/OD		 2 × 8 Mar 8, 2022 OEM
5945WX 12 (24) 4.1 2 × 6
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

Ryzen 7000 series

Raphael (7000 series, Zen 4/RDNA2 based)

Common features of Ryzen 7000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).[i] Models with "F" suffixes are without iGPUs.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Chiplets Core
config[ii]		 TDP Thermal
solution		 Release
date		 MSRP
Base Boost
Ryzen 9 7950X3D 16 (32) 4.2 5.7 128 MB[iii] 2 × CCD
1 × I/OD		 2 × 8 120 W N/a Feb 28, 2023 US $699
7950X 4.5 64 MB 170 W Sep 27, 2022
7900X3D 12 (24) 4.4 5.6 128 MB[iii] 2 × 6 120 W Feb 28, 2023 US $599
7900X 4.7 64 MB 170 W Sep 27, 2022 US $549
7900 3.7 5.4 65 W Wraith Prism, None[iv] Jan 10, 2023 US $429[62]
PRO 7945 Wraith Spire, Wraith Stealth[iv] Jun 13, 2023 OEM
Ryzen 7 7800X3D 8 (16) 4.2 5.0 96 MB 1 × CCD
1 × I/OD		 1 × 8 120 W N/a Apr 6, 2023 US $449
7700X 4.5 5.4 32 MB 105 W Sep 27, 2022 US $399
7700 3.8 5.3 65 W Wraith Prism, None[iv] Jan 10, 2023 US $329[62]
PRO 7745 Wraith Spire, Wraith Stealth[iv] Jun 13, 2023 OEM
Ryzen 5 7600X3D[63][64] 6 (12) 4.1 4.7 96 MB 1 × 6 N/a Aug 31, 2024[v] US $299
7600X 4.7 5.3 32 MB 105 W Sep 27, 2022
7600 3.8 5.1 65 W Wraith Stealth Jan 10, 2023 US $229[62]
PRO 7645 Wraith Spire, Wraith Stealth[iv] Jun 13, 2023 OEM

7500X3D

 4.0 4.5 96 MB N/a Nov 12, 2025 OEM
7500F 3.7 5.0 32 MB Wraith Stealth Jul 22, 2023 US $179[65]
7400F[vi] 4.7 Jan 9, 2025 CNY 849 (Mainland China)[67][68]
APJ Only
7400 3.3 4.3 16 MB Sep 16, 2025 TBA [69]
Close
  1. [i]
    Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
  2. [ii]
    Core Complexes (CCX) × cores per CCX
  3. [iii]
    Only one of the two CCXes has additional 64 MB 3D V-Cache.[59] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[60]
  4. [iv]
    On August 1, 2025, AMD downgraded or ceased including coolers on select models, as a result of its discontinuation of the Wraith Prism and Wraith Spire.[61]
  5. [v]
    Release date for US, where it is only sold though MicroCenter.[63] In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024.[64]
  6. [vi]
    The 7400F uses thermal paste between the silicon and the integrated heat spreader, whereas all other 7000 series models use soldered thermal interface material instead.[66]

Storm Peak (Threadripper 7000 series, Zen 4 based)

Common features of Ryzen 7000 HEDT/workstation CPUs:

  • Socket: sTR5.
  • Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 5FF.
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 MSRP
Base Boost
Ryzen
Threadripper
PRO		 7995WX 96 (192) 2.5 5.1 384 MB 350 W 12 × CCD
1 × I/OD		 12 × 8 Nov 21, 2023[70] US $9999
7985WX 64 (128) 3.2 256 MB 8 × CCD
1 × I/OD		 8 × 8 US $7349
7975WX 32 (64) 4.0 5.3 128 MB 4 × CCD
1 × I/OD		 4 × 8 US $3899
7965WX 24 (48) 4.2 4 × 6 US $2649
7955WX 16 (32) 4.5 64 MB 2 × CCD
1 × I/OD		 2 × 8 US $1899
7945WX 12 (24) 4.7 2 × 6 US $1399
Ryzen
Threadripper		 7980X 64 (128) 3.2 5.1 256 MB 8 × CCD
1 × I/OD		 8 × 8 US $4999
7970X 32 (64) 4.0 5.3 128 MB 4 × CCD
1 × I/OD		 4 × 8 US $2499
7960X 24 (48) 4.2 4 × 6 US $1499
Close
  1. [i]
    Core Complexes (CCXs) × cores per CCX

Ryzen 8000 series

Phoenix (8000 series, Zen 4 based)

Common features of Ryzen 8000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 4 nm FinFET.
More information Branding and model, Cores (threads) ...
Branding
and model		 Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 NPU TDP Core
config[a]		 Thermal
solution		 Release
date		 MSRP
Base Boost
Ryzen 7 8700F 8 (16) 4.1 5.0 16 MB Yes 65 W 1 × 8 Wraith Stealth April 1, 2024[71] OEM[72]
Ryzen 5 8400F 6 (12) 4.2 4.7 No 1 × 6
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX.

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8000G desktop APUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
  • Fabrication process: TSMC 4 nm FinFET.
More information Branding and model, CPU ...
Branding
and model		 CPU GPU NPU TDP Thermal
solution		 Release
date		 MSRP
Cores (threads) Clock rate (GHz) L3 cache
(total)		 Core
config[a]		 Model Core
config[b][c]		 Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 7 8700G[d] 8 (16) 8 (16) N/a 4.2 5.1 16 MB 1 × 8 780M 12 CUs
768:48:24:12		 2.9 Ryzen AI
Up to 16 TOPS		 65 W Wraith Spire (before Aug 1, 2025)
Wraith Stealth (since Aug 1, 2025)[73]		 Jan 31, 2024[74] US $329
PRO 8700GE 3.6 2.7 35 W N/a Apr 16, 2024[citation needed] US $299
Ryzen 5 8600G[d] 6 (12) 6 (12) 4.3 5.0 1 × 6 760M 8 CUs
512:32:16:8		 2.8 65 W Wraith Stealth Jan 31, 2024[74] US $229
PRO 8600GE 3.9 2.6 35 W N/a Apr 16, 2024[citation needed] OEM
8500G[d] 2 (4) 4 (8) 4.1 / 3.2[e] 5.0 / 3.7[f] 2 + 4 740M 4 CUs
256:16:8:4		 2.8 No 65 W Wraith Stealth Jan 31, 2024 US $179
8500GE[d] 3.9 / 3.1[e] 35 W N/a Apr 16, 2024[citation needed] OEM
Ryzen 3 8300G[d] 4 (8) 1 (2) 3 (6) 4.0 / 3.2[e] 4.9 / 3.6[f] 8 MB 1 + 3 2.6 65 W Wraith Stealth Jan 2024 (OEM) /
Q1 2024 (retail)		 OEM /
TBA
8300GE[d] 35 W N/a Apr 16, 2024[citation needed] OEM
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
  2. [b]
    Unified shaders : Texture mapping units : Render output units : Ray accelerators : AI accelerators and Compute units (CU)
  3. [c]
    GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
  4. [d]
    Model also available as PRO version as 8300G[75], 8300GE[76], 8500G[77], 8500GE[78], 8600G[79], 8700G[80].
  5. [e]
    Zen 4 cores' base frequency / Zen 4c cores' base frequency
  6. [f]
    Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Ryzen 9000 series

Granite Ridge (9000 series, Zen 5/RDNA2 based)

Common features of Ryzen 9000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5600 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU with 2 CUs and base and boost clock speeds of 0.4 GHz and 2.2 GHz, respectively. Models with "F" suffixes are without iGPUs.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Models with an "X3D" suffix include 2nd-generation 3D V-Cache in the form of a 64 MB cache die, which augments the L3 cache of one CCD.[81]
  • Models with an "X3D2" suffix or branded as "Dual Edition" include 2nd-generation 3D V-Cache in the form of two 64 MB cache dies (totaling to 128 MB), one die per CCD, which augment the L3 cache of their respective CCD.[82]
  • Fabrication process: TSMC N4X FinFET (N6 FinFET for the I/O die).
More information Branding and Model, Cores (threads) ...
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Thermal
solution		 Release
date		 Launch MSRP
Base Boost
Ryzen 9 9950X3D2
Dual Edition[82]		 16 (32) 4.3 5.6 192 MB [ii] 200 W 2 × CCD
1 × I/OD		 2 × 8 N/a April 22, 2026 US $899
9950X3D[83][84] 5.7 128 MB[iii] 170 W March 12, 2025 US $699
9950X[86][87] 64 MB August 15, 2024 US $649
9900X3D[83][84] 12 (24) 4.4 5.5 128 MB[iii] 120 W 2 × 6 March 12, 2025 US $599
9900X[86][87] 5.6 64 MB August 15, 2024 US $499
Ryzen 7 9850X3D[88] 8 (16) 4.7 96 MB 1 × CCD
1 × I/OD		 1 × 8 January 29, 2026 US $499
9800X3D[89][90] 5.2 November 7, 2024 US $479
9700X[86][87] 3.8 5.5 32 MB 65 W[iv] August 8, 2024 US $359
9700F[91] 65 W September 16, 2025 TBA
Ryzen 5 9600X[86][87] 6 (12) 3.9 5.4 65 W[iv] 1 × 6 August 8, 2024 US $279
9600[92] 3.8 5.2 65 W Wraith
Stealth		 February 19, 2025 TBA
9500F[93] 5.0 September 16, 2025 CN ¥1,299
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Both CCXes have a 3D V-Cache.
  3. [iii]
    Only one of the two CCXes has 3D V-Cache.[85]
  4. [iv]
    TDP configurable to 105 W

Shimada Peak (Threadripper 9000 series, Zen 5 based)

Common features of Ryzen 9000 HEDT/workstation CPUs:

  • Socket: sTR5.
  • Threadripper CPUs support DDR5-6400 in quad-channel mode while Threadripper PRO CPUs support DDR5-6400 in octa-channel mode with ECC support.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Threadripper CPUs support 80 PCIe 5.0 lanes (4 of which runs PCIe 4.0 mode to the chipset; and remaining are usually running as 48 PCIe 5.0 lanes plus 24 PCIe 4.0 lanes), while Threadripper PRO CPUs support 128 PCIe 5.0 lanes (4 of which runs in PCIe 4.0 mode to the chipset), and extra 8 PCIe 3.0 lanes. Some lanes support alternative mode of running SATA3.
  • No integrated graphics.
  • Fabrication process: TSMC 4nm FinFET.
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[i]		 Release
date		 MSRP
Base Boost
Ryzen
Threadripper
PRO		 9995WX 96 (192) 2.5 5.4 384 MB 350 W 12 × CCD
1 × I/OD		 12 × 8 July 2025 [94] $11,699
9985WX 64 (128) 3.2 256 MB 8 × CCD
1 × I/OD		 8 × 8 $7,999
9975WX 32 (64) 4.0 128 MB 4 × CCD
1 × I/OD		 4 × 8 $4,099
9965WX 24 (48) 4.2 4 × 6 $2,899
9955WX 16 (32) 4.5 64 MB 2 × CCD
1 × I/OD		 2 × 8 $1,649
9945WX 12 (24) 4.7 2 × 6 OEM
Ryzen
Threadripper		 9980X 64 (128) 3.2 256 MB 8 × CCD
1 × I/OD		 8 × 8 $4,999
9970X 32 (64) 4.0 128 MB 4 × CCD
1 × I/OD		 4 × 8 $2,499
9960X 24 (48) 4.2 4 × 6 $1,499
Close
  1. [i]
    Core Complexes (CCXs) × cores per CCX

Ryzen AI 400 Series

Gorgon Point AM5 (AI 400 Series, Zen 5/RDNA3.5/XDNA2 based)

Common features of Ryzen AI 400 desktop APUs:[95][96]

  • Socket: AM5.
  • All the CPUs support DDR5-5600 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
  • L1 cache: 80 KB per core.
  • L2 cache: 1 MB per core.
  • Includes integrated RDNA 3.5 GPU.
  • Includes XDNA 2 AI Engine (Ryzen AI).
  • Fabrication process: TSMC 4 nm FinFET.
More information Branding and model, CPU ...
Branding

and model

 CPU GPU NPU

(Ryzen AI)

 TDP Release MSRP
Cores

(threads)

 Clock rate (GHz) L3 cache
Base Boost Model CUs Clock

(GHz)

Ryzen AI 7 450G[a] 8 (16) 2.0 5.1 16 MB Radeon 860M 8 3.1 Up to 50 TOPS 65 W March 2, 2026

(OEM)

 OEM
Ryzen AI 7 450GE[a] 35 W
Ryzen AI 5 440G[a] 6 (12) 4.8 16 MB Radeon 840M 4 2.9 65 W
Ryzen AI 5 440GE[a] 35 W
Ryzen AI 5 435G[a] 4.5 8 MB 2.8 65 W
Ryzen AI 5 435GE[a] 35 W
Close
  1. [a]
    Model also available as PRO version as Ryzen AI 7 PRO 450G, Ryzen AI 7 PRO 450GE, Ryzen AI 5 PRO 440G, Ryzen AI 5 PRO 440GE, Ryzen AI 5 PRO 435G and Ryzen AI 5 PRO 435GE.


Mobile processors

Ryzen 2000 series

Raven Ridge (Zen/GCN5 based)

Common features of Ryzen 2000 notebook APUs:

  • Socket: FP5.
  • The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 12 PCIe 3.0 lanes.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: GlobalFoundries 14LP.
More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model[a] Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 2800H 4 (8) 3.3 3.8 4 MB 1 × 4 RX Vega 11 1.3 704:44:16
11 CUs		 1830.4 35–54 W Sep 10, 2018
2700U[b] 2.2 RX Vega 10 640:40:16
10 CUs		 1664 12–25 W Oct 26, 2017
Ryzen 5 2600H 3.2 3.6 Vega 8 1.1 512:32:16
8 CUs		 1126.4 35–54 W Sep 10, 2018
2500U[b] 2.0 12–25 W Oct 26, 2017
Ryzen 3 2300U[b] 4 (4) 3.4 Vega 6 384:24:8
6 CUs		 844.8 Jan 8, 2018
2200U 2 (4) 2.5 1 × 2 Vega 3 192:12:4
3 CUs		 422.4
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
  2. [b]
    Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

Ryzen 3000 series

Dalí (Zen/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

  • Socket: FP5.
  • All the CPUs support DDR4-2400 in dual-channel mode.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All these CPUs provide 12 PCIe 3.0 lanes. 4 are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: GlobalFoundries 14LP.
More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 3 3250U 2 (4) 2.6 3.5 4 MB 1 × 2 Vega 3 1.2 192:12:4
3 CUs		 460.8 12–25 W Jan 6, 2020
3250C Sep 22, 2020
3200U Jan 6, 2019
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Picasso (Zen+/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[97] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU		 1971.2 15 W Oct 2019
3750H[98] RX Vega 10 640:40:16
10 CU[99]		 1792.0 35 W Jan 6, 2019
3700C[100] 15 W Sep 22, 2020
3700U[a][101] Jan 6, 2019
Ryzen 5 3580U[102] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU		 1497.6 Oct 2019
3550H[103] Vega 8 1.2 512:32:8
8 CU[104]		 1228.8 35 W Jan 6, 2019
3500C[105] 15 W Sep 22, 2020
3500U[a][106] Jan 6, 2019
3450U[107] 3.5 Jun 2020
Ryzen 3 3350U[108] 4 (4) Vega 6 384:24:8
6 CU[109]		 921.6 Jan 6, 2019
3300U[a][110]
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    Model also available as PRO version[111][112][113], released April 8, 2019.

Ryzen 4000 series

Renoir (Zen 2/GCN5 based)

Common features of Ryzen 4000 notebook APUs:

More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a]		 1.75 512:32:8
8 CU		 1792 35–54 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H[114] 2.9 4.2 1.6 448:28:8
7 CU		 1433.6 35–54 W
4800HS 35 W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU		 1996.8 10–25 W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU		 1433.6
Ryzen 5 4600H[115] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU		 1152 35–54 W
4600HS[116] 35 W
4680U[b] 2.1 448:28:8
7 CU		 1344 10–25 W Apr 13, 2021
4600U[c] 384:24:8
6 CU		 1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4 MB 1 × 4 1.4 320:20:8
5 CU		 896
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : texture mapping units : render output units and compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    All of the iGPUs are branded as AMD Radeon Graphics.
  2. [b]
    Only found on the Microsoft Surface Laptop 4.
  3. [c]
    Model also available as PRO version as 4450U,[117] 4650U,[118] 4750U,[119] released May 7, 2020.

Ryzen 5000 series

Lucienne (Zen 2/GCN5 based)

Common features of Ryzen 5000 notebook APUs:

More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a]		 1.9 512:32:8
8 CU		 1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[120] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU		 1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU		 1152
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : texture mapping units : render output units and compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    All of the iGPUs are branded as AMD Radeon Graphics.

Cezanne and Barceló (Zen 3/GCN5 based)

Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

More information Branding and model, CPU ...
Branding and model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost (Single Core) Boost (All Core)
Ryzen 9 5980HX 8 (16) 3.3 4.8 4.4 16 MB 1 × 8 Radeon
Graphics[a]		 2.1 512:32:8
8 CUs		 2150.4 35–54 W Jan 12, 2021
5980HS 3.0 4.0 35 W
5900HX 3.3 4.6 4.2 35–54 W
5900HS 3.0 4.0 35 W
Ryzen 7 5800H[121] 3.2 4.4 2.0 2048 35–54 W
5800HS 2.8 35 W
5825U[b][c] 2.0 4.5 15 W Jan 4, 2022
5800U[b] 1.9 4.4 3.4 10–25 W Jan 12, 2021
Ryzen 5 5600H[131] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs		 1612.8 35–54 W
5600HS 3.0 35 W
5625U[b][c] 2.3 4.3 3.6 15 W Jan 4, 2022
5600U[b] 4.2 10–25 W Jan 12, 2021
5560U 4.0 8 MB 1.6 384:24:8
6 CUs		 1228.8
5500H 4 (8) 3.3 4.2 1 × 4 1.8 1382.4 35–54 W Jun 23, 2023
Ryzen 3 5425U[b][c] 2.3 4.3 3.8 1.6 1228.8 15 W Jan 4, 2022
5400U[b][132] 2.7 4.1 10–25 W Jan 12, 2021
5125C 2 (4) 3.0 N/a N/a 1 × 2 1.2 192:12:8
3 CUs		 460.8 15 W May 5, 2022
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : texture mapping units : render output units and compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    All of the iGPUs are branded as AMD Radeon Graphics.
  2. [b]
    Model also available as PRO version as 5450U,[122] 5650U,[123] 5850U,[124] released on March 16, 2021 and as 5475U,[125] 5675U,[126] 5875U,[127] released on April 19, 2022.
  3. [c]
    Model also available as Chromebook optimized version as 5425C,[128] 5625C,[129] 5825C,[130] released on May 5, 2022.

Ryzen 6000 series

Rembrandt (Zen 3+/RDNA2 based)

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU TDP Release
date
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs		 3686.4 45 W Jan 4, 2022
[133]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs		 1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified shaders : texture mapping units : render output units and compute units (CU)
  3. [iii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. [a]
    Model also available as PRO version (6650U[134], 6650H[135], 6650HS[136], 6850U[137], 6850H[138], 6850HS[139], 6950H[140], 6950HS[141]), released on April 19, 2022.

Ryzen 7000 series

Mendocino (7020 series, Zen 2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Processing
power[ii]
(GFLOPS)
Base Boost
Ryzen 5 7520U[iii] 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU		 1.9 486.4 15 W September 20, 2022[142]
Ryzen 3 7320U[iii] 2.4 4.1
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. [iii]
    Model also available as Chromebook optimized version as 7520C[143] and 7320C[144] released on May 23, 2023

Barcelo-R (7030 series, Zen 3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.
More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)		 Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU		 2.0 2048 15 W January 4, 2023
[145]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU		 1792
7430U 2.3 4.3 1.8 1612.8 Q4 2023
Ryzen 3 (PRO) 7330U 4 (8) 8 MB 1 × 4 Vega
6 CU		 1382.4 January 4, 2023
[146]
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX
  2. [b]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU TDP Release
date[147]
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)		 Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU		 2.2 3379.2 35–54 W April 30, 2023
7735H
7736U 2.7 4.7 15–28 W January 4, 2023
7735U 4.75 15–30 W
7435HS 3.1 4.5 N/a 35–54 W 2024[148]
7435H
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU		 1.9 1459.2 April 30, 2023
7535H
7535U 2.9 15–30 W January 4, 2023
7235HS 4 (8) 3.2 4.2 8 MB 1 × 4 N/a 35–53 W 2024[149]
7235H
Ryzen 3 7335U 3.0 4.3 660M
4 CU		 1.8 921.6 15–30 W January 4, 2023
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX
  2. [b]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU Ryzen　AI TDP Release
date[150]
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)		 Processing power

(GFLOPS)

Total Zen 4 Zen 4c Base Boost
Ryzen 9 (PRO) 7940HS 8 (16) 8 (16) N/a 4.0 5.2 16 MB 1 × 8 780M
12 CU		 2.8 4357 Yes 35-54 W April 30, 2023[b]
7940H[c]
Ryzen 7 (PRO) 7840HS 3.8 5.1 2.7 4201
7840H[c]
(PRO) 7840U 3.3 15-30 W May 3, 2023[b]
7445HS 6 (12) 2 (4) 4 (8) 3.2 4.7 2 + 4 740M
4 CU		 1383 No 20-40 W
Ryzen 5 (PRO) 7640HS 6 (12) 6 (12) N/a 4.3 5.0 1 × 6 760M
8 CU		 2.6 2663 Yes 35-54 W April 30, 2023[b]
7640H[c]
(PRO) 7640U 3.5 4.9 15-30 W May 3, 2023[b]
(PRO) 7545U 2 (4) 4 (8) 3.7 / 3.0[d] 4.9 / 3.5[e] 2 + 4 740M
4 CU		 2.8 1434 No
(PRO) 7540U 6 (12) N/a 3.2 4.9 1 × 6 2.5 1280
Ryzen 3 7440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[d] 4.7 / 3.3[e] 8 MB 1 + 3
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. [b]
    PRO versions launched on 13 June 2023.
  3. [c]
    China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. [d]
    Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. [e]
    Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen 4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Chiplets Core
config[a]		 TDP Release
date[151]
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[ii] 2 × CCD
1 × I/OD		 2 × 8 55–75 W July 27, 2023
7945HX 2.5 64 MB February 28, 2023
7940HX 2.4 5.2 January 17, 2024
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W February 28, 2023
Ryzen 7 7840HX 2.9 5.1 January 17, 2024
7745HX 8 (16) 3.6 5.1 32 MB 1 × CCD
1 × I/OD		 1 × 8 February 28, 2023
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX
  1. [i]
    Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. [ii]
    Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

Ryzen 8000 series

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Key features of Ryzen 8040 notebook APUs:

  • Socket: BGA (FP7, FP7r2 or FP8 type packages).
  • All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2).
  • GPU uses the RDNA 3 (Navi 3) architecture.
  • Some models include first generation Ryzen AI NPU (XDNA).
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Fabrication process: TSMC N4 FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU Ryzen AI TDP Release

date

Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)		 Processing power

(GFLOPS)

Total Zen 4 Zen 4c Base Boost
Ryzen 9 8945HS 8 (16) 8 (16) — 4.0 5.2 16 MB 1 × 8 780M

12 CU

 2.8 4357 Yes 35-54 W December 6, 2023
Ryzen 7 8845HS 3.8 5.1 2.7 4201
8840HS 3.3 20-30 W
8840U 15-30 W
8745HS[152] 3.8 4.9 2.6 4045 No 35–54 W
8745H[153]
Ryzen 5 8645HS 6 (12) 6 (12) 4.3 5.0 1 × 6 760M

8 CU

 2.6 2663 Yes 35-54 W December 6, 2023
8640HS 3.5 4.9 20-30 W
8640U 15-30 W
8540U 2 (4) 4 (8) 3.7 / 3.0[b] 4.9 / 3.5[c] 2 + 4 740M

4 CU

 2.8 1434 No
Ryzen 3 8440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[b] 4.7 / 3.3[c] 8 MB 1 + 3 2.5 1280
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. [b]
    Zen 4 cores' base frequency / Zen 4c cores' base frequency
  3. [c]
    Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range Refresh (8045 series, Zen4/RDNA2 based)

Common features of Ryzen 8045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
More information Branding and model, Cores (threads) ...
Branding and model Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Chiplets Core
config[a]		 TDP Release
date
Base Boost
Ryzen 9 8945HX 16 (32) 2.5 5.4 64 MB 2 × CCD
1 × I/OD		 2 × 8 55–75 W April 23, 2025
8940HX 2.4 5.3
Ryzen 7 8840HX 12 (24) 2.9 5.1 2 × 6 45–75 W
8745HX 8 (16) 3.6 32 MB 1 × CCD
1 × I/OD		 1 × 8
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX
  1. [i]
    Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).

Ryzen 9000 series

Fire Range (Zen 5/RDNA2 based)

Common features of Ryzen 9000 Fire Range series:

  • Socket: FL1
  • All Models support DDR5-5600 in 128-bit mode; Maximum memory: 96 GB
  • All models support 28 PCIe 5.0 lanes
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) : 4
  • Native USB 2.0 (480 Mbit/s): 1
  • iGPU: AMD Radeon 610M (2 CU @ 2200 MHz)
  • No NPU
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core
  • L2 cache: 1 MB per core
  • Fabrication process: TSMC N4 FinFET (CCD) + TSMC N6 FinFET (I/OD)
More information Branding and Model, Cores (threads) ...
Branding and Model Cores (threads) Clock (GHz) L3 cache
(total)		 Chiplets Core config TDP Release date
Base Boost
Ryzen 9 9955HX3D[154] 16 (32) 2.3 5.4 128 MB 2 × CCD
1 × I/OD		 2 × 8 55–75 W 1H 2025
9955HX[154] 2.5 64 MB
9850HX[154] 12 (24) 3.0 5.2 2 × 6 45–75 W
Close


Ryzen 10 Series

Mendocino (10 series, Zen 2/RDNA2 based)

Common features of Ryzen 10 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and Model, CPU ...
Branding and Model CPU GPU TDP Release
date
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[i]		 Model Clock
(GHz)		 Processing (GFLOPS)
Base Boost
Ryzen 5 40 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU		 1.9 486.4 15 W October 1, 2025[155]
Ryzen 3 30 2.4 4.1
Close

Ryzen 100 series

Rembrandt-R (100 series, Zen 3+/RDNA2 based)

Common features of Ryzen 100 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 0
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU TDP Release
date[147]
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)		 Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 170 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU		 2.2 3379.2 35–54 W October 1, 2025
160 2.7 15–30 W
Ryzen 5 150 6 (12) 3.3 4.55 1 × 6 660M
6 CU		 1.9 1459.2 35–54 W
130 2.9 15–30 W
Ryzen 3 110 4 (8) 3.0 4.3 8 MB 1 × 4 660M
4 CU		 1.8 921.6
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX
  2. [b]
    Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Ryzen 200 series

Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)

More information Branding and Model, CPU ...
Branding and Model CPU GPU Ryzen

AI

 TDP Release date
Cores (threads) Clock (GHz) L3 cache
(total)		 Core config Model Clock
(GHz)		 Processing power

(GFLOPS)

Total Zen 4 Zen 4c Base Boost
Ryzen 9 270 8 (16) 8 (16) N/a 4.0 5.2 16 MB 1 × 8 780M
12 CU		 2.8 4357 Yes 35–54 W Q2 2025[156]
Ryzen 7 260 3.8 5.1 2.7 4201
(PRO)
250		 3.3 15–30 W
Ryzen 5 240 6 (12) 6 (12) 4.3 5.0 1 × 6 760M
8 CU		 2.6 2663 35–54 W
(PRO)
230		 3.5 4.9 15–30 W
(PRO)
220		 2 (4) 4 (8) 3.7 / 3.0 4.9 / 3.5 2 + 4 740M
4 CU		 2.8 1434 No
Ryzen 3 (PRO)
210		 4 (8) 1 (2) 3 (6) 3.6 / 2.8 4.7 / 3.3 8 MB 1 + 3 2.5 1280
Close

Ryzen AI 300 series

Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)

Common features of Ryzen AI 300 notebook APUs:

  • Socket: BGA, FP8 package type.
  • All models support DDR5-5600 or LPDDR5X-8000 in dual-channel mode.
  • All models support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • iGPU uses the RDNA 3.5 microarchitecture.
  • NPU uses the XDNA 2 AI Engine (Ryzen AI).
  • Both Zen 5 and Zen 5c cores support AVX-512 using a half-width 256-bit FPU.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N4P FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU NPU
(Ryzen AI)		 TDP Release
date
Cores (threads) Clock (GHz) L3 cache
(total)		 Model Clock
(GHz)
Total Zen 5 Zen 5c Base Boost
(Zen 5)		 Boost
(Zen 5c)
Ryzen AI 9 (PRO)
HX 375		 12 (24) 4 (8) 8 (16) 2.0 5.1 3.3 24 MB 890M
16 CUs		 2.9 55 TOPS 15–54 W June 2, 2024 [157]
(PRO)
HX 370[158]		 50 TOPS
365[158] 10 (20) 6 (12) 5.0 880M
12 CUs
Ryzen AI 7 PRO 360[159][160] 8 (16) 3 (6) 5 (10) 16 MB October 10, 2024 [161]
(PRO)
350		 4 (8) 4 (8) 3.5 860M
8 CU		 3.0 Q1 2025[156]
Ryzen AI 5 (PRO)
340		 6 (12) 3 (6) 3 (6) 4.8 3.4 840M
4 CU		 2.9
330 4 (8) 1 (2) 4.5 8 MB 820M
2 CU		 2.8 15–28 W July 2025 [162]
Close

Strix Halo (Zen 5/RDNA3.5/XDNA2 based)

More information Branding and Model, CPU ...
Branding and Model CPU GPU Memory NPU
(Ryzen AI)		 Chiplets Core
config		 TDP Release date
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Model Clock
(GHz)		 Bus type
& width (Max memory)		 Clock
(MT/s)		 Bandwidth
(GB/s)
Base Boost
Ryzen AI MAX+ (PRO)
395		 16 (32) 3.0 5.1 64 MB 8060S
40 CUs		 2.9 LPDDR5X
256-bit
(128 GB)		 Up to
8000		 Up to
256		 50 TOPS 2 × CCD
1 × I/OD with GPU		 2 × 8 45–120 W Q1 2025 [163]
392 12 (24) 3.2 5.0 2 × 6 Q1 2026
Ryzen AI MAX (PRO)
390		 8050S
32 CUs		 2.8 Q1 2025
Ryzen AI MAX+ 388 8 (16) 3.6 32 MB 8060S
40 CUs		 2.9 1 × CCD
1 × I/OD with GPU		 1 × 8 Q1 2026
Ryzen AI MAX (PRO)
385		 8050S
32 CUs		 2.8 Q1 2025
PRO 380 6 (12) 4.9 16 MB 8040S
16 CUs		 LPDDR5X
128-bit
(64 GB)		 Up to
128		 1 × 6
Close

Ryzen AI 400 series

Gorgon Point (Zen 5/RDNA3.5/XDNA2 based)

Common features of Ryzen AI 400 notebook APUs:

  • Socket: BGA, FP8 package type.
  • All models support DDR5-5600 or LPDDR5X-8000 (LPDDR5X-8533 for 440, 450, 465, 470, 475 series) in dual-channel mode.
  • All models support 16 PCIe 4.0 lanes.
  • Native USB 40Gbps (USB4) Ports: 2
  • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) Ports: 2
  • iGPU uses the RDNA 3.5 microarchitecture.
  • NPU uses the XDNA 2 AI Engine (Ryzen AI).
  • Both Zen 5 and Zen 5c cores support AVX-512 using a half-width 256-bit FPU.
  • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • Fabrication process: TSMC N4P FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU NPU
(Ryzen AI)		 TDP Release
date
Cores (threads) Clock (GHz) L3 cache
(total)		 Model Clock
(GHz)
Total Zen 5 Zen 5c Base Boost
(Zen 5)		 Boost
(Zen 5c)
Ryzen AI 9 (PRO)
HX 475		 12 (24) 4 (8) 8 (16) 2.0 5.2 3.3 24 MB 890M
16 CUs		 3.1 60 TOPS 15–54 W January 5, 2026
(PRO)
HX 470		 55 TOPS
(PRO)
465[a]		 10 (20) 6 (12) 5.0 880M
12 CUs		 2.9 50 TOPS
Ryzen AI 7 (PRO)
450[a]		 8 (16) 4 (8) 4 (8) 5.1 3.6 16 MB 860M
8 CUs		 3.1
445[a] 6 (12) 2 (4) 4.6 3.5 8 MB 840M
4 CUs		 2.9
Ryzen AI 5 PRO 440[a] 3 (6) 3 (6) 4.8 16 MB
(PRO)
435[a]		 2 (4) 4 (8) 4.5 3.4 8 MB 2.8
430 4 (8) 1 (2) 3 (6) 15–28 W
Close
  1. [a]
    Model also available as "H" version as H 430, H 435, H PRO 435, H PRO 440, H 445, H PRO 445, H 450, H PRO 450, H 465, and H PRO 465, but lacks support for AMD EXPO and FreeSync technologies.


Handheld gaming PC processors

Ryzen Z1 series (Zen 4/RDNA3 based)

Common features of Ryzen Z1 handheld APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 20 PCIe 4.0 lanes.
  • Includes integrated RDNA 3 GPU.
  • Fabrication process: TSMC 4 nm FinFET.
More information Branding and model, CPU ...
Branding and model CPU GPU Default
TDP		 Configurable
TDP		 Release
date
Cores
(threads)		 Clock (GHz) L3 cache
(total)		 Core
config[a]		 Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen Z1 Extreme 8 (16) 8 (16) N/a 3.3 5.1 16 MB 1 × 8 AMD Radeon Graphics
RDNA 3
12 CU		 2.9 28 W 9–30 W May 2023[164]
Z1 6 (12) 2 (4) 4 (8) 3.2 (average)
3.7 (Zen 4)
3 (Zen 4c)		 4.9 (Zen 4)
3.5 (Zen 4c)		 2 + 4 AMD Radeon Graphics
RDNA 3
4 CU		 2.8
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Ryzen Z2 series (multiple architectures)

More information Branding and Model, Codename ...
Branding and Model Codename Process CPU GPU NPU
(Ryzen AI)		 Default
TDP		 Configurable
TDP		 Release date
Cores (threads) Clock (GHz) L3 cache
(total)		 Core
config[a]		 Architecture Compute
units		 Clock
(GHz)
Total Zen 2/3+/4/5 Zen 5c Base Boost
Ryzen AI Z2 Extreme Strix Point TSMC
4 nm[165]		 8 (16) 3 (6)
(Zen 5)		 5 (10)
(Zen 5c)		 2.0 5.0 / 3.3 16 MB 3 + 5 RDNA3.5 16 2.9 50 TOPS 28 W 15–35 W June 2025[166]
Ryzen Z2 Extreme N/a Q1 2025[167]
Z2 Hawk Point TSMC
4 nm[168]		 8 (16)
(Zen 4)		 N/a 3.3 5.1 1 × 8 RDNA3 12 2.7 15–30 W
Z2 Go Rembrandt+ TSMC
6 nm[169]		 4 (8) 4 (8)
(Zen 3+)		 3.0 4.3 8 MB 1 × 4 RDNA2 12 2.2
Z2 A Van Gogh TSMC
7 nm[170]		 4 (8)
(Zen 2)		 2.8 3.8 4 MB 8 1.8 15 W 6–20 W June 2025 [166]
Close
  1. [a]
    Core Complexes (CCX) × cores per CCX or Zen 5 + Zen 5c cores

Embedded processors

1000 series

Great Horned Owl (V1000 series, Zen/GCN5 based)

More information Model, Release date ...
Model Release
date		 Fab CPU GPU Memory
support		 TDP Junction
temp.
range
(°C)
Cores
(threads)		 Clock rate (GHz) Cache Model Config[ii] Clock
(GHz)		 Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
V1202B February 2018 GloFo
14LP		 2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core		 512 KB
per core		 4 MB Vega 3 192:12:16
3 CU		 1.0 384 DDR4-2400
dual-channel		 12–25 W 0–105
V1404I December 2018 4 (8) 2.0 3.6 Vega 8 512:32:16
8 CU		 1.1 1126.4 -40–105
V1500B 2.2 N/a N/a 0–105
V1605B February 2018 2.0 3.6 Vega 8 512:32:16
8 CU		 1.1 1126.4
V1756B 3.25 DDR4-3200
dual-channel		 35–54 W
V1780B December 2018 3.35 N/a
V1807B February 2018 3.8 Vega 11 704:44:16
11 CU		 1.3 1830.4
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX
  2. [ii]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. [iii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Banded Kestrel (R1000 series, Zen/GCN5 based)

More information Model, Release date ...
Model Release
date		 Fab CPU GPU Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache Model Config[i] Clock
(GHz)		 Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
R1102G February 25, 2020 GloFo
14LP		 2 (2) 1.2 2.6 64 KB inst.
32 KB data
per core		 512 KB
per core		 4 MB Vega 3 192:12:4
3 CU		 1.0 384 DDR4-2400
single-channel		 6 W
R1305G 2 (4) 1.5 2.8 DDR4-2400
dual-channel		 8-10 W
R1505G April 16, 2019 2.4 3.3 12–25 W
R1606G 2.6 3.5 1.2 460.8
Close
  1. [i]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. [ii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000 series

Grey Hawk (V2000 series, Zen 2/GCN5 based)

More information Model, Release date ...
Model Release
date		 Fab CPU GPU Socket PCIe
support		 Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache Archi-
tecture		 Config[i] Clock
(GHz)		 Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[171] Nov 10, 2020[172] TSMC
7FF		 6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core		 512 KB
per core		 8 MB GCN 5 384:24:8
6 CU		 1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0		 DDR4-3200
dual-channel
LPDDR4X-4266
quad-channel		 10–25 W
V2546[171] 3.0 3.95 35–54 W
V2A46[171] Jan 4, 2023[173] 3.2 448:28:8
7 CU		 1.6 1433.6
V2718[171] Nov 10, 2020 8 (16) 1.7 4.15 10–25 W
V2748[171] 2.9 4.25 35–54 W
Close
  1. [i]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. [ii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

River Hawk (R2000 series, Zen+ based)

More information Model, Release date ...
Model Release
date		 Fab CPU GPU Socket PCIe
support		 Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache Archi-
tecture		 Config[i] Clock
(GHz)		 Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
R2312[174] June 7, 2022[175] GloFo
12LP		 2 (4) 2.7 3.5 64 KB inst.
32 KB data
per core		 512 KB
per core		 4 MB GCN 5 192:12:4
3 CU		 1.2 460.8 FP5 8 lanes
Gen 3		 DDR4-2400
dual-channel ECC		 10–25 W
R2314[174] 4 (4) 2.1 384:24:8
6 CU		 921.6 16 lanes
Gen 3		 DDR4-2666
dual-channel ECC		 10–35 W
Close
  1. [i]
    Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. [ii]
    Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

3000 series

(V3000 series, Zen 3 based)

More information Model, Release date ...
Model Release
date		 Fab CPU Socket PCIe
support		 Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache
Base Boost L1 L2 L3
V3C14[176][177] September 27, 2022[178] TSMC
7FF		 4 (8) 2.3 3.8 32 KB inst.
32 KB data
per core		 512 KB
per core		 8 MB FP7r2 20
(8+4+4+4)
PCIe 4.0		 DDR5-4800
dual-channel		 15 W
V3C44[176][177] 3.5 3.8 45 W
V3C16[176][177] 6 (12) 2.0 3.8 16 MB 15 W
V3C18I[176][177] 8 (16) 1.9 3.8 15 W
V3C48[176][177] 3.3 3.8 45 W
Close

5000 series

(Ryzen Embedded 5000 series, Zen 3 based)

Common features of Ryzen Embedded 5000 series CPUs:

  • Socket: AM4.
  • All the CPUs support ECC DDR4-3200 dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • No integrated graphics.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Fabrication process: TSMC 7FF.
More information Processor branding, Model ...
Processor
branding		 Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Chiplets Core
config[i]		 TDP Release
date
Base Boost
Ryzen
Embedded		 5950E[179] 16 (32) 3.05 3.4 64 MB 2 × CCD
1 × I/OD		 2 × 8 105 W Apr 20, 2023
5900E[180] 12 (24) 3.35 3.7 2 × 6
5800E[181] 8 (16) 3.4 32 MB 1 × CCD
1 × I/OD		 1 × 8 65-100 W
5600E[182] 6 (12) 3.3 3.6 1 × 6 65 W
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

7000 series

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

Common features of Ryzen Embedded 7000 series CPUs:

  • Socket: AM5.
  • All the CPUs support ECC DDR5-5200 dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
More information Processor branding, Model ...
Processor
branding		 Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Chiplets Core
config[i]		 TDP Release
date
Base Boost
Ryzen
Embedded		 7945 12 (24) 3.7 5.4 64 MB 2 × CCD
1 × I/OD		 2 × 6 65 W Nov 14, 2023[183]
7745 8 (16) 3.8 5.3 32 MB 1 × CCD
1 × I/OD		 1 × 8
7700X 4.5 5.4 105 W
7645 6 (12) 3.8 5.1 1 × 6 65 W
7600X 4.7 5.3 105 W
Close
  1. [i]
    Core Complexes (CCX) × cores per CCX

P100 series

(Ryzen AI Embedded P100 series, Zen 5/RDNA 3.5 based)

Model numbers with the "i" suffix are marketed for industrial use and support operating at colder ambient temperatures.[184] Model numbers with the "a" suffix are marketed for automotive use and are AEC-Q100 qualified for reliability and longevity.[184]

Common features of Ryzen AI Embedded P100 series CPUs:

  • Socket: BGA, FP8 package type.
  • L3 cache (total): 8 MB.
  • All models support dual-channel ECC DRAM.
  • All models support 14 PCIe 4.0 lanes.
  • Native 10GbE ports (with TSN): 2[184]
  • Native USB 5Gbps (USB 3.2 Gen 1 operation mode): 1
  • Native USB 5Gbps (USB 3.1 Gen 1 operation mode): 1
  • Native USB 2.0 (480 Mbit/s): 4
  • iGPU uses the RDNA 3.5 microarchitecture and supports output at up to 120 FPS to up to either 4 × 4K or 2 × 8K displays.[184]
  • iGPU supports encoding/decoding video at up to 4K & 60 Hz.
  • All iGPUs support HDMI 2.1 and DisplayPort 2.0 output.
  • NPU uses the XDNA 2 architecture.[184]
  • Rated longevity: "2.5 years (Standard), Up to 10 years (Extended)"[184]
More information Processor branding, Model ...
Processor
branding		 Model CPU GPU Memory
support		 NPU
TOPS		 USB4
ports		 Nominal
TDP		 Configurable
TDP		 Junction
temperature
range		 Release
date
Cores
(threads)		 Boost clock
(GHz)		 L2 cache
(total)		 CU Clock
(GHz)		 eDP
version
Ryzen AI
Embedded		 P132i 6 (12) 4.5 6 MB 4 2.8 1.4 LPDDR5X-8000
DDR5-5600		 50 2 28 W 15–54 W −40 °C – 105 °C Q2 2026[184]
P132 0 °C – 105 °C
P132a 3.7 4 MB 2.4 1.5 LPDDR5X-7500
with RAS[184]		 No 45 W 25–45 W −40 °C – 105 °C
P121i 4 (8) 4.4 4 MB 2 2.7 1.4 LPDDR5X-7500
DDR5-5600		 30 2 28 W 15–54 W −40 °C – 105 °C
P121 0 °C – 105 °C
P122a 3.7 4 2.0 1.6 LPDDR5X-7500
with RAS[184]		 No 15–30 W −40 °C – 105 °C
Close

See also

References

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