Rolf Alfons Aschenbrenner
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Rolf Alfons Aschenbrenner | |
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| Born | c.1964 (age 61–62) |
| Occupation | Mechanical engineer |
| Academic background | |
| Alma mater | University of Giessen |
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| Discipline | Mechanical engineering |
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Rolf Alfons Aschenbrenner (born c. 1964) is an engineer who works for Fraunhofer IZM in Berlin, Germany. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 "for contributions to microelectronic packaging".[1]
In 1986, Aschenbrenner received a Bachelor of Science degree in mechanical engineering from the University of Giessen, followed in 1991 by a Master of Science degree in physics from the same university. He then worked at the university until 1992 during which he helped with a project for Spacelab mission D2. In 1993, Aschenbrenner worked at Technische Universität Berlin before joining Fraunhofer in March 1994.[2]
In October 2010, Aschenbrenner was appointed as deputy head of Fraunhofer IZM, where he coheaded its System Integration and Interconnection Technologies department. He is a senior member of IEEE and has supported its Components, Packaging, & Manufacturing Technology (CPMT) Society, working in multiple committees and serving in two vice presidential positions. Aschenbrenner became CPMT president in January 2010[3] and served until December 2011.[2] In 2017, CPMT changed its name to the Electronics Packaging Society (EPS).[4]
Aschenbrenner has written or contributed to more than 100 journal and proceedings articles on electronic packaging, and has more than 14 patents related to microelectronic packaging. He received a "best paper award" at a 1995 conference and an international recognition award in 2005 from an electronics manufacturers R&D consortium.[3][2]
References
- ↑ "2013 Newly Elevated Fellows" (PDF). IEEE. p. 2. Archived from the original (PDF) on 29 August 2017. Retrieved 13 April 2017.
- 1 2 3 "Bio Aschenbrenner". IEEE Electronics Packaging Society. Retrieved 8 May 2025.
- 1 2 "Rolf Aschenbrenner is Fraunhofer IZM's new deputy head". Fraunhofer IZM. 28 October 2010. Retrieved 8 May 2025.
- ↑ "EPS History". IEEE Electronics Packaging Society. Retrieved 8 May 2025.
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