Rolf Alfons Aschenbrenner

In 1986, Aschenbrenner received a Bachelor of Science degree in mechanical engineering from the University of Giessen, followed in 1991 by a Master of Science degree in physics from the same university. He then worked at the university until 1992 during which he helped with a project for Spacelab mission D2. In 1993, Aschenbrenner worked at Technische Universität Berlin before joining Fraunhofer in March 1994.^[2]

In October 2010, Aschenbrenner was appointed as deputy head of Fraunhofer IZM, where he coheaded its System Integration and Interconnection Technologies department. He is a senior member of IEEE and has supported its Components, Packaging, & Manufacturing Technology (CPMT) Society, working in multiple committees and serving in two vice presidential positions. Aschenbrenner became CPMT president in January 2010^[3] and served until December 2011.^[2] In 2017, CPMT changed its name to the Electronics Packaging Society (EPS).^[4]

Aschenbrenner has written or contributed to more than 100 journal and proceedings articles on electronic packaging, and has more than 14 patents related to microelectronic packaging. He received a "best paper award" at a 1995 conference and an international recognition award in 2005 from an electronics manufacturers R&D consortium.^[3][2]